Название: Advanced Flip Chip Packaging Автор: Ho-Ming Tong, Yi-Shao Lai Издательство: Springer Год: 2013 Формат: PDF Размер: 21 Мб Язык: английский / English
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
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Advanced Flip Chip Packaging 
